This is the most common approach, which is a specific design and fabrication per circuit per device:


  • Maximum Burn-in Board Density
  • Lowest per unit cost
  • Most reliable way to go, since clocks and power would be designed for maximum performance¬†tailored for the specific circuit.
  • It is most effective when cost of socket is minimal, this tends to work best for small pin count in DIPS, SOIC, PLCC, and LCC packages


  • Boards are dedicated for one type of circuit and package only
  • The cost maybe hard to justify if the burn-in boards will be used for a one time qualification. However, that is usually part of what reliability cost is all about.